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compared with the traditional contact flatness detection method, hanchine 3d depth camera uses surface structured light to perform fast and high-precision three-dimensional imaging of the inspected workpiece, and detects and locates the defect area by analyzing the point cloud data of the workpiece. the detection efficiency is greatly improved, and at the same time, the workpiece is detected in a natural state, and the detection result is more authentic, and the potential external force influence and physical damage caused by the contact detection method on the workpiece itself are avoided. 

01 flatness measurement of mobile phone midplane 

• testing requirements 

check whether there are up-convex and/or under-concave defects on the middle board, where the upper-convex limit value is 0.05mm and the under-convex limit value is -0.25mm. 

the distance value of the point cloud relative to the fitting plane is displayed by the information box of the point (as in the above figure c2m signed distance[<0.2] = xxx), the measurement of a single product is completed every two seconds, and the gom offline value is compared the absolute error is less than 0.03mm. 

02 chip flatness measurement 

• testing requirements 

the chip size is 29*32 mm. it detects the flatness of the pcb board on the side of the chip with gold fingers to avoid false soldering and missing soldering at the gold fingers and pads in downstream operations due to poor flatness. 

with high-precision 3d imaging equipment as the core, supplemented by hdr and appropriate point cloud processing algorithms, optical non-contact flatness detection of workpieces with highly reflective and (or) dark surfaces can be realized.